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Aceris designs and builds inspection and metrology 3D-2D sensors for the semiconductor BEOL market, including wafers, substrates and PCBs. Besides sensor we design, specify, and integrate precision mechanical stages and specific material handling system to be used by end users, or integrated by OEMs in Asia Pacific, Americas and Europe.
3D Laser Triangulation (LT) with 2D sensor
3D Laser Triangulation (LT) with 2D sensor
Blue, 405nm laser telecentric 3D optics allows a very thin uniform line and much higher depth of field than red or NIR lasers. Back-illuminated 16.13M pixel 2D sensor with high sensitivity and low noise. Both 3D and 2D sensors use high NA, telecentric lenses. High-power RGB LED strobes provide microsecond pulses to minimize motion artefacts.
2D sensor with 3D Depth from Focus (DFF)
2D sensor with 3D Depth from Focus (DFF)
Autofocus microscope with 33mm image size optics with powerful RGB strobe lighting. High speed, high resolution back-illuminated 43M pixel images, 14bit resolution at 100 frame per seconds. Enhanced focus and 3D images with Depth From Focus scanning.
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